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voltage detectors voltage detector ics with watchdog timer bd37ax x series bd87ax x series bd99a41f general description the bd37a19fvm, bd37a41fvm, bd87a28fvm, bd87a29fvm, bd87a34fvm, bd87a41fvm and bd99a41f are watchdog timer reset ics. it delivers a high precision detection voltage of 1.5% and a super - low current consumption of 5 a (typ). it can be used in a wide range of electronic devices to monitor power supply voltages and in system operation to prevent runaway operation. features ? built - in w atchdog t imer ? reset delay time can be set with the ct pin's external capacitance ? watchdog timer monitor time and reset time can be set with the ctw pin's external capacitance. ? output c ircuit t ype: n -c hannel o pen d rain applications all devices using microcont rollers or dsp, including vehicle equipment, displays, servers, dvd players, and telephone systems key specification s ? reset p ower s upply v oltage r ange : 1.0 v to 10v ? wdt p ower s upply v oltage r ange: 2.5 v to 10v ? high p recision d etection v oltage: (ta = 25 c) 1.5% ( ta = ? 40 c to 105 c) 2.5% ? super -l ow c urrent c onsumption: 5 a(typ) ? o perating t emperature r ange: - 40 c to + 105 c packages w (typ) x d (typ) x h (max) ? msop8 2.90mm x 4.00mm x 0.90mm ? sop8 5.00mm x 6.20mm x 1.71mm ordering information b d 3 7 a 1 9 f v m - t r part number 37a wdt h active 87a wdt l active 99a wdt h active detection voltage 19 1.9v 28 2.8v 29 2.9v 34 3.4v 41 4.1v package fvm : msop8 f : sop8 packaging and forming specification tr : embossed tape and reel e2: embossed tape and reel lineup detection voltage ( typ) inh logic package orderable part number 1.9v h: active msop8 reel of 3 000 bd37a19fvm - tr 4.1v h: active msop8 reel of 3 000 bd37a41fvm - tr 2.8v l: active msop8 reel of 3 000 bd87a28fvm - tr 2.9v l: active msop8 reel of 3 000 bd87a29fvm - tr 3.4v l: active msop8 reel of 3 000 bd87a34fvm - tr 4.1v l: active msop8 reel of 3 000 bd87a41fvm - tr 4.1v h: act ive sop8 reel of 25 00 bd99a41f -e2 product structure silicon monolithic integrated circuit this product has not designed protection against radioactive rays . 1/ 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 tsz22111 ? 14 ? 001 www.rohm.com datashee t downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet pin configuration s figure 1. pin configuration s pin description s bd37a xxfvm bd87a xx fvm / bd99a41f no. pin name function no. pin name function 1 clk clock input from microcontroller 1 ctw wdt time setting capacitor connection pin 2 ct reset delay time setting capacitor connection pin 2 ct reset delay time setting capacitor connection pin 3 ctw wdt time setting capacitor connection pin 3 clk clock input from microcontroller 4 vdd power s upply pin 4 gnd gnd pin 5 n.c. nc pin 5 vdd power supply pin 6 gnd gnd pin 6 inh wdt on / off setting pin inh=h/l:wdt=off/on(bd87a xxfvm) inh=h/l:wdt=on/off(bd99a41f) 7 inh wdt on / off setting pin inh=h/l:wdt=on/off 7 n.c. nc pin 8 reset reset output pin 8 reset reset output pin block diagram s bd37axxfvm bd87axxfvm / bd99a41f ct pin capacitor: 470pf to 3.3f ctw pin capacitor: 0.001f to 10f figure 2. block diagrams msop8 (top view) 1 2 3 4 8 7 6 5 sop8 (top view) 1 2 3 4 8 7 6 5 reset inh vref v dd gnd n.c. v dd vthh vthl r s q r s q + + + clk ct ctw vdd 1 2 3 4 8 7 6 5 puls e generation circuit pulse generation circuit ctw ct clk gnd reset n.c. vref v dd inh v dd vdd vthh vthl r s q r s q 1 2 3 4 5 6 7 8 + + + 2/ 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet absolute maximum ratings (ta=25 ) parameter symbol r atings unit power s upply v oltage *1 v dd ? 0.3 to 10 v ct p in v oltage v ct ? 0.3 to v dd + 0.3 v ctw p in v oltage v ctw ? 0.3 to v dd + 0.3 v reset p in v oltage v reset ? 0.3 to v dd + 0.3 v inh p in v oltage v inh ? 0.3 to v dd + 0.3 v clk p in v oltage v clk ? 0.3 to v dd + 0.3 v power d issipation pd 0.47 *2 w 0.55 *3 operating a mbient t emperature topr ? 40 to + 105 c storage t emperature ts t g ? 55 to + 125 c maximum j unction t emperature tjmax 125 c *1 do not exceed pd. *2 msop8 : reduced by 4.70 mw/ over 25 c , wh en mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). *3 sop8 : reduced by 5.50 mw/ over 25 c , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). caution: operating the ic over the absolute maximum ratings may damage the ic. the damage ca n either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is impo rtant to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. re commended operating ratings (ta = ? 40 c to 105 c) parameter symbol min max unit reset p ower s upply v oltage v dd reset 1.0 10 v wdt p ower s upply v oltage v dd wdt 2.5 10 v electrical characteristics (unless otherwise specified, ta = ? 40 c to 105 c , v dd = 5 v) parameter symbol limits unit con ditions min typ max [overall] total s upply c urrent 1 (during wdt operation) i dd1 5 14 a inh : wdt on logic input ctw = 0 .1 f total s upply c urrent 2 (when wdt stopped) i dd2 5 14 a inh : wdt off logic input output l eak c urrent i leak 1 a v dd = v ds = 10 v output c urrent c apacity i ol 0.7 ma v dd = 1.2v, v ds = 0.5 v [reset] detection v oltage 1 1.9v detect v det1 1.871 1.900 1.929 v ta = 25 c 2.8v detect v det1 2.758 2.800 2.842 v ta = 25 c 2.9v detect v det1 2.886 2.930 2.974 v ta = 25 c 3.4v detect v det1 3.349 3.400 3.451 v ta = 25 c 4.1v detect v det1 4.039 4.100 4.162 v ta = 25 c detection v oltage 2 1.9v detect v det2 1.852 1.900 1.948 v ta = ? 40 c to 105 c 2.8v detect v det2 2.730 2.800 2.870 v ta = ? 40 c to 105 c 2.9v detect v de t2 2.857 2.930 3.003 v ta = ? 40 c to 105 c 3.4v detect v det2 3.315 3.400 3.485 v ta = ? 40 c to 105 c 4.1v detect v det2 4.007 4.100 4.202 v ta = ? 40 c to 105 c hysteresis w idth 1.9v detect vrhys v det 0.03 v det 0.13 v det 0.19 v ta=?40 c to 105 c 2.8v detect vrhys v det 0.018 v det 0.045 v det 0.060 v ta=?40 c to 105 c 2.9v detect vrhys v det 0.02 v det 0.05 v det 0.06 v ta=?40 c to 105 c 3.4v detect vrhys v det 0.02 v det 0.05 v det 0.07 v ta=?40 c to 105 c 4.1v detect vrhys v det 0.018 v det 0.035 v det 0.050 v ta=?40 c to 105 c 3/ 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet electrical characteristics - continued (unless otherwise specified, ta = ?40 c to 105 c , v dd = 5 v) parameter symbol limits unit conditions min typ max reset transmission d elay t ime: l ow h igh t plh 3.9 6.9 10.1 ms c ct = 0.00 1 f *1 when v dd = v det 0.5 v delay c ircuit r esistance rrst 5.8 10.0 14.5 m v ct = gnd delay p in t hreshold v oltage v cth v dd 0.3 v dd 0.45 v dd 0.6 v r l = 470k delay p in o utput c urrent i ct 150 a v dd = 1.50v, v ct = 0.5 v min o perating v oltage v opl 1.0 v v ol 0.4v, r l = 470 k [wdt] wdt m onitor t ime t wh 7.0 10.0 20.0 ms c ctw = 0.01 f *2 wdt r eset t ime t wl 2.4 3.3 7.0 ms c ctw = 0.01 f *3 clock i nput p ulse w idth t wclk 500 ns clk h igh t hreshold v oltage v clkh v dd 0.8 v dd v clk l ow t hreshold v oltage v clkl 0 v dd 0.3 v inh h igh t hreshold v oltage v inhh v dd 0.8 v dd v inh l ow t hreshold v oltage v inhl 0 v dd 0.3 v ctw c harge c urrent i ctwc 0.25 0.50 0.75 a v ctw = 0.2 v ctw d ischarge c urrent i ctwo 0.75 1.50 2.00 a v ctw = 0.8 v *1 t plh can be varied by changing the ct capacitance value. t plh (s) 0.69 rrst (m) c ct (f) rrst = 10 m (typ) *2 t wh can be varied by changing the c tw capacitance value. t wh (s) (0.5 c c tw (f))/i ctwc (a) i ctwc = 0.5 a (typ) *3 t wl can be varied by changing the ctw capacitance value. t wl (s) (0.5 c c tw (f)) /i ctwo (a) i ctwo = 1.5 a (typ) 4/ 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet 0 2 4 6 8 10 0 2 4 6 8 10 supply voltage: vdd [v] circuit current: idd [a] 0 50 100 150 200 250 300 350 400 0 1 2 3 4 5 supply voltage: vdd [v] ct pin current: ict [a] . typical performance curves (unless otherwise specified, ta = 25 c ) : 4.1v detection figure 4. total supply current figure 5. delay pin current vs power supply voltage figure 6. ctw charge discharge current figure 3. detection voltage ta=25c ta = -40c ta=105c -1 -0.5 0 0.5 1 1.5 2 0 1 2 3 4 5 ctw pin voltage: vctw [v] ctw pin current: ictw [a] 0 2 4 6 8 10 12 0 2 4 6 8 10 supply voltage: vdd [v] reset voltage: vreset [v] . 5/15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet 0 0.5 1 1.5 2 0 2 4 6 8 10 reset voltage: vreset [v] reset current: ireset [ma] 1 10 100 1000 10000 0.0001 0.001 0.01 0.1 ct pin capacity: ct [f] output delay time: tplh [ms] . 0.1 1 10 100 1000 10000 0.001 0.01 0.1 1 10 ctw pin capacity: ctw [v] wdt reset time: tw [ms] 3.5 3.75 4 4.25 4.5 4.75 5 -40 0 40 80 ambient temperature: ta [ ] detection voltage: vdet [v] typical performance curves C continu ed (unless otherwise specified, ta = 25 c ) : 4.1v detection figure 8. t reset transmission delay time vs capacitance figure 9. wdt time vs capacitance figure 10. detection voltage vs temperature figure 7. output current ta=25c ta = -40c ta=105c moniter time reset time l h h l 6/ 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet 0 0.25 0.5 0.75 1 -40 0 40 80 ambient temperature: ta [ ] operating voltage: vopl [v] 8 9 10 11 12 13 -40 0 40 80 ambient temperature: ta [ ] output delay resistance: rrst [m] 5 6 7 8 9 10 -40 0 40 80 ambient temperature: ta [ ] output delay time: tplh [ms] 0 3 6 9 12 15 -40 0 40 80 ambient temperature: ta [ ] wdt reset time: tw [ms] typical performance curves C continu ed (unless otherwise specified, ta = 25 c ) : 4.1v detection figure 12. ct pin circuit resistance vs temperature figure 13. reset transmission delay time vs temperature figure 14. wdt time vs temperature figure 11. operating marginal v oltage vs temperature 7/ 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet timing c hart figure 1 5 . timing chart explanation the reset pin voltage (reset) switches to low when the power supply voltage (v dd ) falls to 0.8 v. the external capacitor connected to the ct pin begins to charge when vdd rises above the reset detec tion voltage (v deth ). the reset signal stays low until vdd reaches the v d eth voltage and switches to high when vdd reaches or exceeds the v deth voltage. the reset transmission delay time t plh allowed to elapse before reset switches from low to high is given by the following equation: t plh (s) 0.69 rrst c c t (f) ? ? [1] rrst denotes the ic's built - in resistance and is designed to be 10 m (typ). c ct denotes the external capacitor connected to the ct pin. the external capacitor connected to the ctw pin begins to charge when reset rises, triggering t he watchdog ti mer. the ctw pin state switches from charge to discharge when the ctw pin voltage (v ctw ) reaches vthh, and reset switches from high to low. the watchdog timer monitor time t wh is given by the following equation: t wh (s) (0.5 c ctw (f))/(i ctwc ) ? ? [2 ] i ctwc denotes the ctw charge current and is designed to be 0.50 a (typ). c ctw denotes the external capacitor connected to the ctw pin. the ctw pin state switches from charge to discharge when v ctw reaches vthl, and reset switches from low to high. the watchdog timer reset time t wl is given by the following equation: t wl (s) (0.5 c ctw (f))/(i ctwo ) ? ? [3] i ctwo denotes the ctw discharge current and is designed to be 1.50 a (typ). the ctw pin state may not switch from charge to discharge when the clk input pulse width t wclk is short. use a t wclk input pulse width of at least 500 ns. t wclk 500 ns (min) when a pulse (positive edge trigger) of at least 500 ns is input to the clk pin while the ctw pin is char ging, the ctw state switches from charge to discharge. once it discharges to vthl, it will charge again. watchdog timer operation is forced off when the inh pin switches to low ( l: bd37axx series. bd99a41f, h: bd87axxseries ) . at that time, only the watchdog timer is turned off. reset detection is performed normally. the watchdog timer function turns on when the inh pin switches t o high (h : bd37axx series. bd99a41f, l: bd87axxseries ) . the external capacitor connected to the ctw pin begins to charge at that time. reset switches from high to low when vdd falls to the reset detection voltage (v det ) or lower. ? when vdd falls to 0 v, the reset signal stays low until vdd reaches 0.8 v. *2 (bd37a xx fvm bd99a41f) ? inh v ctw clk reset 0 0 0 0 0 wdt circuit turns off when inh is high t wclk * 4 t wclk vthh vthl *1 t plh *3 twl twh v ct v cth inh v dd v deth v det wdt circuit turns off when inh is low 0 0 v deth =v det +vrhys (bd87a xx fvm) 8/ 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet power dissipation msop8 sop8 figure 1 6. power dissipation i/o equivalence c ircuit clk inh ct ctw reset figure 1 7. i/o equivalen ce circuit ambient temperature: ta [c] 0 400 200 25 50 75 125 100 0 power dissipation: pd [mw] 600 470mw 800 1 05 c when mounted on a glass epoxy board (70 mm 70 mm 1.6mm) ja = 212.8 ( c /w) ambient temperature: ta [c] 0 400 200 25 50 75 125 100 0 power dissipation: pd [mw] 600 550 mw 800 1 05 c when mounted on a glass epoxy board (70 mm 70 mm 1.6mm) ja = 181.8 ( c /w) reset ct w vdd vdd clk vdd inh vdd ct 10 m (typ) vdd vdd 9/ 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet external s ettings for p ins and precautions 1. connect a capacitor (0.001 f to 1,000 f) between the vdd and gnd pins when the power line impedance is hi gh. use of the ic when the power line impedance is high may result in oscillation. 2. external c apacitance a capacitor must be connected to the ctw pin. when using a large capacitor such as 1 f, the inh pin must all ow a ctw discharge time of at least 2 ms. the power - on reset time is given by equation [1] on page 8 . the wdt time is given by eq uations [2] and [3] on page 8 . the setting times are proportional to the capacitance value from the equations, so the maximum and minimum setting times can be calculated from the electrical characteris tics according to the capacitance. note however that the electrical characteristics do not include the ext ernal capacitor's temperature characteristics. operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity wh en connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluct uations in the small - signal ground caused by large currents. also ensure that the ground traces of external c omponents do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in t emperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrus h current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or st ep. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspect ion process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the p cb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10 / 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet operational notes C continued 11. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements i n order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n l ayers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substr ate) should be avoided. fig ure 18 . example of monolithic ic structure 12. applications or inspection processes with modes where the potentials of the vdd pin and other pins ma y be reversed from their normal states may cause damage to the ic s internal circuitry or elements. use an output pin capacitance of 1000 f or lower in case vdd is shorted with the gnd pin while the external capac itor is charged. it is recommended to insert a diode for preventing back current flow in series with vdd or byp ass diodes between v dd and each pin. fig ure 1 9. 13. when vdd falls below the operating marginal voltage, output will be open. when output is being pulle d up to input, output will be equivalent to vdd. 14. regarding t he clk and inh pins the clk and inh pins comprise inverter gates and should not be left open. (these pins s hould be either pulled up or down.) input to the clk pin is detected using a positive edge trigger and does not af fect the clk signal duty. input the trigger to the clk pin w ithi n the t wh time. bypass diode vdd back current prevention diode pin n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements 11 / 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet physical dimension , tape and reel information package name msop8 12 / 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet physical dimension , tape and reel information C continued package name sop8 (unit : mm) pkg : sop8 drawing no. : ex11 2- 5001 -1 (max 5.35 (include.burr)) 13 / 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet marking diagrams part number marking package part number d3719 msop8 reel of 3 000 bd37a19fvm - tr d3741 msop8 reel of 3 000 bd37a41fvm - tr d8728 msop8 reel of 3 000 bd87a28fvm - tr d8729 msop8 reel of 3 000 bd87a29fvm - tr d8734 msop8 reel of 3 000 bd87a34fvm - tr d8741 msop8 reel of 3 000 bd87a41fvm - tr 99a41 sop8 reel of 25 00 bd99a41f -e2 sop8(top view) part number marking lot number 1pin m ark msop8(top view) part number marking lot number 1pin mark 14 / 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
bd37axx series bd87axx series bd99a41f data s heet revision history date revision changes 12 . apr.201 3 001 new release 25.apr.2013 002 p. 8 explanation modified. p. 9 figure 17. i/o equivalence circuit the error in writing of the part of clk was corrected. 05 . sep .2014 003 applied the rohm standard style 15 / 15 tsz02201 - 0g1g0an00130 -1-2 ? 2013 rohm co., ltd. all rights reserved. 05.sep.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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